Thermafoil® TIM Thermal Interface Materials from EGC Enterprises
The most cost-effective solution to tough thermal management problems.

Thermafoil® TIM Thermal Interface Materials are key components for the next generation of high power electronics, providing superior conformance in an extremely thin, flexible package to help you achieve advanced thermal management requirements. Thermafoil® TIM, manufactured from 100% natural graphite, are in a class by themselves combining high thermal conductivity and exceptionally low contact resistance, even under minimal application pressures. Thermafoil® thermal interfaces are ideal for use in the most demanding applications, such as those requiring an overall thermal resistance of less than 0.1° C in2/W.

Thermafoil® TIM has been developed by Graftech Inc and EGC Enterprises, the leaders in graphite technology. Our patented materials and process technology enable us to produce the thinnest graphite interface products, resulting in the lowest thermal resistance. Thermafoil® TIM products are available with ultra-thin, conductive pressure sensitive adhesives (PSA) for ease of assembly while maintaining high conductivity.

[High Thermal Conductivity with Directional Heat Flow]

Thermafoil® materials are unique in combining excellent thermal conductivity with the directional properties of graphite. Compared to typical heat transfer materials used for thermal management, Thermafoil® components exhibit up to 25% higher thermal conductivity. Further, other heat conducting materials are isotropic, making it impossible to modify the direction of conductivity. With the directional thermal conductivity of Thermafoil® TIM as high as 225 W/mK along the length and width, components can be designed to rapidly transfer heat away from delicate electronics.

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Click below for more information:

High Thermal Conductivity with Directional Heat Flow
The Advantages of Anisotropic Material
Thermafoil® TIM Test Comparisons

Contact EGC to obtain your sample of Thermafoil® TIM and review your thermal management application.

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